BF flotation cell has two types: type I and type II. Type I is improved as suction cell referring to model SF; type II is improved as direct flow cell referring to model JJF.
Each feeding inlet of Xinhai cyclone unit is installed knife gate valve independently developed by Xinhai. This valve with small dimension reduces the diameter of cyclone unit.
The supports at both ends of cone crusher main shaft, scientific design of crushing chamber, double insurance control of hydraulic and lubricating system.
Wet type overflow ball mill is lined with Xinhai wear-resistant rubber sheet with excellent wear resistance, long service life and convenient maintenance
Wet type grid ball mill is lined with Xinhai wear-resistant rubber sheet with excellent wear resistance design, long service life and convenient maintenance.
Ring groove rivets connection, plate type screen box, advanced structure, strong and durable Vibration exciter with eccentric shaft and eccentric block, high screening efficiency, large capacity
Xinhai improves the traditional specification of crushing chamber by adopting high speed swing jaw and cambered jaw plate.
High-speed hammer impacts materials to crush materials. There are two ways of crushing (Wet and dry)
The cone slide valve is adopted; the failure rate is reduced by 80%; low energy consumption;the separation of different material, improvement of the processing capacity by more than 35%.
Cylindrical energy saving grid ball mill is lined grooved ring plate which increases the contact surface of ball and ore and strengthens the grinding.
20-30%. Rolling bearings replace slipping bearings to reduce friction; easy to start; energy saving 20-30%
Both sides of the impeller with back rake blades ensures double circulating of slurry inside the flotation tank. Forward type tank, small dead end, fast foam movement
Grinding Accuracy, Thickness variation within one wafer between wafers, μm Click the equipment photo to open the product catalog PDF. Back To Top.
DISCOs grinding wheels grind silicon wafers, compound semiconductors, crystals, and a wide variety of other materials.
The TAIKO process is a wafer backgrinding method developed by DISCO. This process method leaves a ring approximately 3 mm on the wafer outer edge and
The newly developed GF01 Series in-feed grinding wheels feature a special aluminum base unique to DISCO. Without any change in processes or addition of equipment, Poligrind helps improve post-grinding surface Back To Top
Aug 21, 2013 Disco DFG 850 Wafer Grinder prior to removal from clean room. 2000 Vintage Universal wafer chucks 4"-8" Capable [email protected]
Dec 2, 2014 Okamoto Grinders - The Winners Circle - Addy Machinery - Duration: 5:26. Steve Addy 1,516 views 5:26. PhableR 100 lithography tool for
arm, the Disco 840 and 841 machines feature a same-cassette return function. In-feed grinding with wafer rotation; Two independently adjustable spindles
We use fully-automated Disco and Strasbaugh wafer backgrinding equipment to achieve the highest possible level of quality and can continuously achieve thin
out by using commercial back grinding system Disco Corp. Japan. In thinning process, first the scale using the special equipment called Nanoindenter. This.
DBG is the preferred process when both dicing and grinding has to be Subsequently, back grinding is performed until reaching the groove and, thus,
Product Type: Equipment. Application: Grinding. Product Description: The Disco DFG8540 System is a fully automatic in-feed surface grinder. With its
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
Used on backgrinding machines for thinning and flattening silicon wafers, Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others.
Sep 21, 2015 Backgrinding: CORWIL uses automated and semi-automated Disco equipment and grind wheels to process wafers. Speeds, grind wheel grits,
Machines In addition, DGP8760 offers grinding and polishing in one complete unit. DFP8140 DFP8160 DGP8760. Dry Polishing Wheel. DISCOs specially-developed wheel for stress relief has the following features: Back To Top.
Quik-Pak utilizes state-of-the-art equipment from Disco, Ultron and Royce to offer Wafer Backgrinding or Thinning Dicing of Silicon, Glass, Quartz, Laminate,
The stringent requirements for these grinding wheels include those in smart cards and smart labels RFID demands more advanced back-grinding processes. . .. model for the wafer shape,” International Journal of Machine Tools and Manufacture, Vol. 44, No. 7–8, pp. .  Disco Website, http:www.disco.co.jp.
From UV irradiation following the back grinding process, to alignment, mounting on dicing frames, and peeling of back grinding tape, all in a single machine. 2. this mounter with the DISCO Corporations DFG8000 series back grinder or
Description. The Disco Automatic Grinder DAG 810 Model 810 is a single-spindlesingle-chuck-table unit that performs back-side grinding on samples.
DAStech, a spinoff of Disco, is known as the leader in Slicing Saws and technology. back grind wheels, UV and Non-UV tape for both dicing and back grinding. wafer washers, UV curing equipment and a closed loop system designed to
Results 1 - 48 of 59910 Shop eBay for great deals on Disco Other Semiconductor & PCB Manufacturing. Youll find new or HP Verigy E6978-66502 Back Plane Board for 93000 Tester - Qty 4 Available. Reference Maker: Lam Research.
From UV irradiation following the back grinding process, to alignment, mounting on dicing frames, and peeling of back grinding tape, all in a single machine. this mounter with the DISCO Corporations DFG8000 series back grinder or
Welcome to Disco. DISCO leads the industry in dicing, grinding and polishing technologies. Our dicing equipment is comprised of lasers, singulation
Disco DFG 8540 Back grinder for Sale by SDI Group.Disco,DFG have for sale. Otherwise you can use our search box for semiconductor equipment for sale.
Wafers are first laminated using an automatic taping machine. After inspection, they are placed on a Disco 84X series infeed grinder. The appropriate grinder
Dec 6, 2017 DISCO has developed a stealth dicing SD*1 laser saw provided the SDBG Stealth Dicing Before Grinding process*2 through DFL7361,
This is a for sale ad about DISCO DFG850 wafer back grinder. 385174 posted in Grinders & Polishers section, a subcategory of Semiconductor Equipment.
grinder DFG840, Disco Corporation, Tokyo, Japan and G&N surface grinder Nanogrinder,. Grinding Machines Nuernberg, Inc., Erlangen, Germany. 2.2.
Edge Protection of Temporarily Bonded Wafers during Backgrinding DISCO HI-TEC AMERICA, Inc., 3270 Scott Blvd., Santa Clara, CA 95054 USA . 0 mm is ideal in this situation and is also acceptable for most semiconductor equipment.
May 31, 2016 DISCO Corporation: Corporate Communications Office equipment provider, has signed a global distribution agreement with grinding, polishing solutions to customers. After a recognized leader in back-end processing.
Solutions for silicon,sapphire, glass, and compound wafer grinding. - Solutions Metals. DISCO. TSK. OKAMOTO. NP. BG 01. BG 02. BG 03. Machine. D. T. O.
PKG Back-Grinder List - SurplusGLOBAL. Equipment Search [SG45504] DISCO DGP8761 300mm wafer back grinder, 2018-07-11, ING, DISCO DGP8761
μm using DISCO DFG850 backgrinding machine at CORWIL. The roughness after μm. Wafers are subsequently split to be chemical mechanically polished
May 7, 2015 Mechanical backgrinding has been the standard process for wafer thinning in advantages in manufacturing throughput, equipmentprocess cost, and It has been reported by Disco that the Taiko process is capable of
Grinding and Dicing Services, complete resource for Wafer Polishing, Grinding, Dicing ,Plating, Back grinding ,Dye SLevel Thinning in San Jose. Equipment List Strasbaugh 7AF & 7AA grinders; Disco DFG 8540 grinder brand new
The equipments TTC system enables tape application with tape tension control, From UV irradiation following the back grinding process, to alignment, In-line operation with DISCO Corporation DFG8000 series or DGP8000 series
DISCOs Kiru cutting technology allows materials to be cut into tiny and Grinding Equipment . Looking back at the year ended March 2016, how would you.
ser-machined without damaging the front and back sur- . ground back surface after the back grinding BG process. .. the first machines on the market.
Jun 30, 2015 either be a part of the saw or a standalone machine.  The .. layers on the dicing streets or if the wafer back grinding process has produced high tensile residual .. Figure 22 Disco DFD6340 fully automatic dicing saw .
Find out all of the information about the DISCO HI-TEC EUROPE GmbH of the process from wafer backgrinding to dry polishing on the same chuck table for high composite material cutting machine laser CNC automatic DxL7020 series.
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