BF flotation cell has two types: type I and type II. Type I is improved as suction cell referring to model SF; type II is improved as direct flow cell referring to model JJF.
Each feeding inlet of Xinhai cyclone unit is installed knife gate valve independently developed by Xinhai. This valve with small dimension reduces the diameter of cyclone unit.
The supports at both ends of cone crusher main shaft, scientific design of crushing chamber, double insurance control of hydraulic and lubricating system.
Wet type overflow ball mill is lined with Xinhai wear-resistant rubber sheet with excellent wear resistance, long service life and convenient maintenance
Wet type grid ball mill is lined with Xinhai wear-resistant rubber sheet with excellent wear resistance design, long service life and convenient maintenance.
Ring groove rivets connection, plate type screen box, advanced structure, strong and durable Vibration exciter with eccentric shaft and eccentric block, high screening efficiency, large capacity
Xinhai improves the traditional specification of crushing chamber by adopting high speed swing jaw and cambered jaw plate.
High-speed hammer impacts materials to crush materials. There are two ways of crushing (Wet and dry)
The cone slide valve is adopted; the failure rate is reduced by 80%; low energy consumption;the separation of different material, improvement of the processing capacity by more than 35%.
Cylindrical energy saving grid ball mill is lined grooved ring plate which increases the contact surface of ball and ore and strengthens the grinding.
20-30%. Rolling bearings replace slipping bearings to reduce friction; easy to start; energy saving 20-30%
Both sides of the impeller with back rake blades ensures double circulating of slurry inside the flotation tank. Forward type tank, small dead end, fast foam movement
Processing for applications which use the DBG system or DAF Die attach film is also possible by incorporating a polisher and wafer mounter with the grinder into an inline Click the equipment photo to open the product catalog PDF.
The DBG in-line system comprises the following machines: and protective tape peeling in one smooth process using a special DISCO DBG grinder and Lintec
DISCOs grinding wheels grind silicon wafers, compound semiconductors, crystals, and a wide variety of other materials.
It is a chemical-free normal grinding process resulting in a low environmental impact, and allows wafer thinning grinding with ease of operation.
Dicing Saws; Laser Saws; Grinders; Polishers; Wafer Mounter; Die Separator; Surface Planer; WaterJet Saw; Products for New Processes; Equipment
Listings 1 - 24 of 38 Used. Hallde RG-1-PAT Grinder and Dicer Listing: 474253 Disco DAD522 Dicing Saws-Scribers Precision Automatic Wafer Dicing.
Jul 13, 2015 Dicing and laser saw systems, together with inspection systems and dual-cut processing, DISCOs ablation laser saw and stealth dicing saw, Rudolphs leader in precision cutting, grinding, and polishing technologies Kiru, Kezuru, PrivacyTerms Conflict Mineral Policy California Supply Chains Act.
Abstract: To enhance the operation of mineral grinding processes, a greater number of monitoring services and processing equipment, a greater number of intelligent functionalities .. Barrat, D.J., Allan, M.J., Mular, A.L.,. University of British
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